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DEK ASIA
Screen Printer, Solder Ball Attach System, Stencil, Selective Printing, Wafer/Substrate Bumping |
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BTU INTERNATIONAL
Sealing Furnace, Reflow Ovens, Heat-up, Wafer Auto Loaders, Cure Conveyor Ovens |
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EXCEL TECHNOLOGY
CO2 Laser, UV Laser, Green Laser, YAG Laser System (Lamp & Diode Pumped) |
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NKE FLEXIBLE
Tape N' Reel System, Laser Mark Systems, Robotics Automation, Test Handlers |
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PALOMAR TECHNOLOGIES
Die Bond & Wire Bond Machines, In-line PCB Solutions for Photonics Butterfly Modules, MEMS Assemblies, RF TX/Rx, Hybrid, Chip-On-Board Modules, Automatic Component Assembly Cell, Fiber Align System |
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UNITEK BENCHMARK
Seam Sealing & Projection Welder |
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PUREX
Laser Fume Extractor |
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MICRO MODULAR SYSTEM
Clinching Machine, M-Matrix, Automatic Trim and Form Machines |
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POLYTOOL INTEGRATION
Dicing Saw Machine |
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SONY PRECISION ENG'G CENTER
Video Microscope |
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SOLVISION / MACHINE VISION INTERNATIONAL
IC BGA/CSP/QFN Package In-Tray Inspection System, Wafer Substrate Inspection Systems |
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I SYSTEMS
Solder Paste Height Inspection System |
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EMBEDDED DATA SYSTEMS LTD.
SolderStar Temperature Profiler |
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TEMPTRONIC CORPORATION
ThermoStream Systems, ThermoSpot System, ThermoChuck Systems, |
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PHOENIX
X-ray Systems
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